The Design and Applications of Embedded Passives on Flexible PCB Substrates

摘要

This paper demonstrates the design and application of embedded passives on flexible PCBs (printed circuit boards). Embedded capacitors and inductors are integrated in a four-layer flexible PCB process. Four copper layers and three organic materials constitute the PCB lamination. The library of embedded passives is developed by measurements, simulations and circuit models. In addition, the 3D transformation models of embedded passives are also presented. Thus, the electrical deviations between bended and straight structures are estimated. Therefore, the feasibility of embedded passives is verified by the library and transformation models.