PB-FREE SOLDER FOR PORTABLE AND HIGH TEMPERATURE ELECTRONIC DEVICES

摘要

As the European Union's (EU's) RoHS directives came into force on July 2006, the transition to lead-free solder has occurred at a rapid pace. Many manufacturers have adopted Sn/Ag/Cu (SAC)-type solder alloys as a representative Pb-free solder to substitute the conventional Tin-Lead (Sn-Pb) system with many reliability anomalies unanswered. This paper is an effort to compare solder reliability between the two most popular Pb-free solders SAC305 and SAC 105 for temperature cycling and drop test. Solder reliability for drop test and temperature cycling were determined experimentally and verified using finite element simulations. The results were interpreted and the recommendations for the right Pb-free solder were made for practical applications.