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Use of novel photoresists in the production of submillimeter-wave integrated circuits

机译:新型光刻胶在亚毫米波集成电路生产中的应用

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Abstract: A new technique is reported for micro-machining millimeter and submillimeter-wave rectangular waveguide components using an advanced thick film UV photoresist known as EPON$+TM$/ SU-8. The recent introduction of this resist has been of great interest to the millimeter-wave and terahertz micro-machining communities, as it is capable of producing features up to 1 mm in height with very high aspect ratios in only a single UV exposure. It therefore represents a possible low-cost alternative to the LIGA process. S-parameter measurements on the new rectangular waveguides show that they achieve lower loss than those produced using other on-chip fabrication techniques, they have highly accurate dimensions, are physically robust, and cheap and easy to manufacture. !12
机译:摘要:已报道了一种新技术,该技术使用称为EPON $ + TM $ / SU-8的先进厚膜UV光刻胶对毫米波和亚毫米波矩形波导组件进行微加工。这种抗蚀剂的最新引入引起了毫米波和太赫兹微加工领域的极大兴趣,因为它仅在一次UV曝光下就能够产生高达1 mm的特征并且具有非常高的纵横比。因此,它代表了LIGA工艺的一种低成本替代方案。新矩形波导上的S参数测量表明,与使用其他片上制造技术所产生的损耗相比,它们的损耗更低,它们具有高度精确的尺寸,坚固耐用,价格便宜且易于制造。 !12

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