Advanced Composite Materials for Air-Cooled Electronic Enclosures

摘要

Today's military aircraft are extremely weight critical in oder to ensure performance and fuel efficiency. New, replacement, or upgraded electronic systems have much more stringent system weight reuirements than those in the past. In addition to being weight critical, space and volume have also become limiting design criterias in order to make the systems adaptable for multiple platforms .Tied with the requirements for expanded system capability, this results in densely populated electronic enclosures with increased thermal loads. Finally, the enclosures must be structural in nature in order to operate on multiple platforms such as fixed and rotary wing aircraft.