Managing the Relationship between Electromagnetic Compatibility, Thermal Design, and Component Life

摘要

System thermal management, containment of electromagnetic interface (EMI), and control of audible noise, are all highly inter-related. Control of these design constraints impact system availability and Mean Time Between Failure (MTBF). Typically, the lowest cost thermal solution will have a negative impact on MEBF. However, products are allowed to implement these solutions for several reasons: modern ICs can tolerate more heat and the product designer is allowed to avoid the overall cost of the system. Total cost of system operation and availability is incurred by the customer. For large commercial computers, product engineers will generate site preparation documents. This document contains requirements which allows proper operation of delivered hardware. Typically, data certers and network hubs employing large commercial data processing equipment require tons of air conditioning with associated delivery schemes.