A computational feasibility study of using solid-liquid Phase Change Materials (PCMs) for periodic power dissipating devices is reported. Thermal enhancement has been studied with PCM enclosed inside microchannels within the semiconductor devices. PCMs perform well at lower power levels for silicon carbide devices but the use of high thermal conditivity spreaders become mandatory at higher power levels. PCM effectiveness and temperature reductions as a function of die thickness, channel width and power dissipated is presented. Temperature reductions up to 25 deg C can be realized with a combination of diamond spreaders and PCM filled microchannels.
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