The 3-D IC with 4-layer Structure for the Fast Range Sensing System

摘要

The 4-layer 3-D IC with having image sensing and its signal processing capabilities is newly designed and fabricated. Fundamental operation of each circuit is confirmed in a 4-layer device structure. It is also indicated from the circuit evaluations that about 30 times faster signal processing will be achieved in the case of the chip being applied for the fast range sensing system, than in the convensional system.