首页> 外文会议>Solid State Device Research Conference, 1991. ESSDERC '91 >Manufacturability of 3D-Epitaxial-Lateral-Overgrowth CMOS Circuits with Three Stacked Channels
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Manufacturability of 3D-Epitaxial-Lateral-Overgrowth CMOS Circuits with Three Stacked Channels

机译:具有三个堆叠通道的3D外延横向过度生长CMOS电路的可制造性

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Epitaxial lateral overgrowth of Si over oxide has been perfected to yield dual-gate transistor stacks with three stacked channels providing high and matched transconductances. Threshold voltage with standard deviation ranging from 50mV to 110mV allow complex 3D logic circuits like parallel multipliers.
机译:Si在氧化物上的外延横向过生长已得到完善,以生产具有三个堆叠沟道的双栅晶体管堆叠,从而提供了高且匹配的跨导。标准偏差在50mV至110mV范围内的阈值电压允许使用复杂的3D逻辑电路,例如并行乘法器。

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