HYBRID PACKAGING OF CIRCUITS AND DEVICES ONTO FLEXIBLE SCREEN PRINTED ELECTICAL INTERCONNECTS

摘要

Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications such as invasive medical instruments, and offering a wide range of advantages from light-weight to high-density. Taking planar one-dimensional flexible systems onto the next level of low-cost yet high-speed and high-performance electronic and opto-electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. laser diodes, batteries, microcontrollers, ASICs etc., to flexible interconnects exist. In this work, we develop a packaging solution for inexpensive sensor systems for large-scale applications. In particular, a comprehensive surface mount technology (SMT) for rigid silicon dioxide based ICs onto flexible glycol-modified polyethylene terephthalate (PET-G) screen-printed interconnects is developed. Here, the SMT solution addresses four main challenges: low thermal budget of PET-G, inorganicity and rigidity of ICs, non-solder ability of the screen-printed structures, and bendability requirements on the assembly. Besides, various environmental reliability aspects of the assembled end product are investigated and verified to be met.