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Direct numerical approach for analyzing thermal wave interferometry data

机译:用于分析热波干涉测量数据的直接数值方法

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Thermal wave interferometry (TWI) for materials characterization is based on detecting the surface temperature variations caused by a modulated heat source at the material surface, and consequently deducing the internal structure from the observed thermal energy propagation properties. The usefulness of the methodology has been accepted for a large variety of measurement problems, including thermal diffusivity determination of materials, coatings thermal properties and thicknesses, detection of laminations, detection of bulk defects, etc. A typical TWI system is shown in Figure 1. The sruface is illuminated with square-wave modulated uniform laser light and the thermal response is observed radiometrically with an IR-detector. Measurements of the relative amplitude of the surface and the phase difference between the excitation and the surface temperature variation are obtained.
机译:材料表征的热波干涉测量法(TWI)基于检测由材料表面的调制热源引起的表面温度变化,从而从观察到的热能传播特性中推断内部结构。对于各种测量问题,该方法的有用性已被接受,包括材料的热扩散测定,涂层热性能和厚度,叠片检测,散装缺陷的检测等。图1中所示的典型TWI系统。用方波调制均匀的激光照射Sruface,并用红外探测器显着地观察热响应。获得了表面的相对幅度的测量和激发和表面温度变化之间的相位差。

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