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Direct numerical approach for analyzing thermal wave interferometry data

机译:分析热波干涉数据的直接数值方法

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Thermal wave interferometry (TWI) for materials characterization is based on detecting the surface temperature variations caused by a modulated heat source at the material surface, and consequently deducing the internal structure from the observed thermal energy propagation properties. The usefulness of the methodology has been accepted for a large variety of measurement problems, including thermal diffusivity determination of materials, coatings thermal properties and thicknesses, detection of laminations, detection of bulk defects, etc. A typical TWI system is shown in Figure 1. The sruface is illuminated with square-wave modulated uniform laser light and the thermal response is observed radiometrically with an IR-detector. Measurements of the relative amplitude of the surface and the phase difference between the excitation and the surface temperature variation are obtained.
机译:用于材料表征的热波干涉法(TWI)基于检测由材料表面处的调制热源引起的表面温度变化,并因此从观察到的热能传播特性中推断出内部结构。该方法的有效性已被广泛用于各种测量问题,包括材料的热扩散率确定,涂层的热性能和厚度,叠层的检测,体缺陷的检测等。典型的TWI系统如图1所示。用方波调制的均匀激光照射表面,并用红外探测器辐射测量观察热响应。获得了表面的相对振幅以及激发与表面温度变化之间的相位差的测量值。

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