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A 1.24pJ/b 112Gb/s (870Gbps/mm) Transceiver for In-package Links in 7nm FinFET

机译:1.24pj / b 112gb / s(870gbps / mm)收发器,用于7nm finfet中的包装链接

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This paper describes the design of a 1.24pJ/b 112Gb/s PAM4 transceiver testchip in 7nm FinFET for in-package die-to-die communication. The receiver supports 0-1.2V input common mode and utilizes a single-stage active inductor-based CMOS CTLE with 12 data slicers and 2 error slicers. The quad-rate voltage-mode transmitter implements delay based sub-UI two-tap FFE and digital I/Q and DCC clock calibration. A single-phase clock from a wideband LC PLL is distributed to eight transceiver channels. In each channel, an ILO generates eight-phase clocks that feed an 8-bit CMOS PI. The transceiver achieves <1e-12 BER over 30mm channel @106.25Gb/s and over 20mm channel @112Gb/s.
机译:本文介绍了7NM FinFET中1.24PJ / B 112GB / S PAM4收发器Testchip的设计,用于包装模具与模具通信。 接收器支持0-1.2V输入公共模式,并利用具有12个数据切片器和2个错误切片器的单级有源电感的CMOS CTL。 Quad-rate电压模式发送器实现基于延迟的子UI双击FFE和数字I / Q和DCC时钟校准。 来自宽带LC PLL的单相时钟分布到八个收发器通道。 在每个通道中,ILO生成馈送8位CMOS PI的八相时钟。 收发器在106.25GB / s和超过20mm频道@ 112GB / s通道上实现<1E-12 BER。

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