Investigation of Mixed-Mode Input Impedance of Multi-Layer Differential Vias for Impedance Matching with Traces

摘要

In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential vias have also been studied in this paper. This method can be used to optimize via structures in PCB design processes for smooth via-trace transitions.