This paper presents a new 600V SPM package, which combines with the features of the latest trench Field-Stop technology IGBT and optimized gate driver IC to achieve the excellent solution for motor drives applications in home appliances. Especially, this module is adopted and optimized to integrated bootstrap circuitry in drive IC which can be supported for a simple layout and less PCB space to develop a motor drive power stage. Also, using the Master and Slave technique, the SPM 8 package is able to reduce the total chip size up to 20% in term of same function compared to other IPM module with conventional half bridge gate driver IC. This paper describes an overall description of the new SPM device as well as the package structure, thermal performance, Master/Slave Drive IC concept and electrical characteristics of the IGBT about the newly developed 600V motion control IPM.
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