Nanosilver Paste for Low Pressure Die Attach: A Turn Key Process

摘要

In this work, we present a new solder paste for die attach based on a bimodal nanosilver particle blend, with good mechanical, electrical and thermal characteristics. Also, in order to simplify processing while achieving a good repeatability and improved reliability, a sintering furnace has been developed providing the required control of sintering atmosphere, temperature, pressure and time in a programmed sequence with just the push of a button. The sintering proceeds under a vacuum of