Fabrication of Pb-free Sn-Bi solder using Polyoxyethylene Lauryl Ether

摘要

Lead-free solders have been gaining more and more attention recently. Sn-Bi system is one of the most promising candidates as the lead-free solder materials. In this article Polyoxyethylene lauryl ether (Brij 35) was used as the additive in the electrochemical deposition of Sn-Bi alloy. Various current densities and bath compositions have been investigated. Sn-Bi composites were successfully deposited on a copper substrate. The deposits were then characterized and studied by scanning electron microscopic (SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD) and differential scanning calorimeter (DSC). Results indicate that the morphology and crystalline orientations are composition dependent. Intermetallic compound (IMC) was formed during the reflow process.