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Rapid Non-invasive temperature Measurment of Complex SI Structures Using In-Situ Spectroscopic Ellipsometry.

机译:使用原位光谱椭偏仪快速无创地测量复杂SI结构的温度。

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Use of spectroscopic ellipsometry for temperature monitoring of complex Si structures is discussed. System calibration is demonstrated for Si epitaxy between 610 degree and 850 degree on our growth system and shown to be in reasonable agreement with reference data in the literature. use of virtual interface analysis of spectroscopic ellipsometry spectra is shown to allow an emitance-free determination of wafer temperature during growth on complex silicon-on-insulator substrates and highights the large errors obtained from the corresponidng pyrometer measurement. Measurement of emittance using spectrosopic elipsometry to correct the pyrometer values is shown to be feasible. Accurate realisation of epitaxial designs is obtained using spectroscopic ellipsometry to end-point thicknesses of epitaxial layers and differential techniques are introduced as a potentially more accourate and absolute source of temperature values.
机译:讨论了椭圆偏振光谱法用于复杂硅结构温度监测的方法。在我们的生长系统上证明了Si外延在610度和850度之间的系统校准,并与文献中的参考数据合理地吻合。通过使用光谱椭圆偏振光谱的虚拟接口分析,可以在绝缘子上复杂的硅衬底上生长过程中无辐射地确定晶片温度,并且可以提高从高温计测量获得的大误差。使用分光镜椭偏仪校正高温计值来测量发射率是可行的。使用分光镜椭圆偏光法测量外延层的端点厚度可以精确实现外延设计,并引入了差分技术作为温度值的潜在更精确和绝对的来源。

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