Direct Fabrication of Super -Fine Wiring and Bumping by Using Inkjet process

摘要

A super-fine inkjet technology that enables fine pattern processing by super fine droplets measuring less than 1 micro-meter are developed. Direct drawing of metal wires having a width of just a few microns have we have been achieved by using a conductive paste which is made from nano-metal particles as an ink. Furthermore, direct forming of three-dimensional structures at any point on the substrate have been demonstrated, by taking advantage of the fast drying by such fine droplets. The process is simple and it can be carried out on the desktop in the air at room temperature. This technology should be useful from the keywords of current packaging trend of miniaturization and integration.