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Source Side Thermal Runaway of Trench IGBTs, Dependence on Design Aspects

机译:沟槽式IGBT的源极侧热失控,取决于设计方面

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The high-current turn-off behaviour of trench IGBTs with dense shunting of the parasitic npn and with shallow p emitters was investigated both by simulation and experiment. In spite of current localization mechanisms (dynamic avalanche, npn transistor injection) there is no indication for a regenerative on-state under isothermal conditions, even at high temperatures up to 750K. Stable current filamentation and device destruction can only be obtained including thermal feedback. Deep trenches result in more stable behaviour, obviously from reduced maximum temperature in the source cell.
机译:通过仿真和实验研究了寄生NPN密集分流和浅P发射器的沟槽IGBT的高电流关断行为。尽管目前的定位机制(动态雪崩,NPN晶体管注入),但在等温条件下,甚至在高达750K的高温下也没有针对再生导通状态的指示。只能获得稳定的电流丝网和器件破坏,包括热反馈。深沟的行为导致了更稳定的行为,显然是从源电池中的最高温度降低。

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