首页> 外文期刊>IEE proceedings. Part G, Circuits, devices and systems >Optimum design of 1.4 kV non-punch-through trench IGBTs: the nextgeneration of high-power switching devices
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Optimum design of 1.4 kV non-punch-through trench IGBTs: the nextgeneration of high-power switching devices

机译:1.4 kV非穿通沟槽式IGBT的优化设计:下一代大功率开关器件

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摘要

The trench insulated gate bipolar transistor (IGBT) is widelynregarded as a worthy replacement of DMOS IGBTs and GTO thyristors in anwide range of applications, from motor control (1.4 kV) to HVDC (6.5nkV). An optimum design of 1.4 kV NPT trench IGBTs using a new fullynintegrated optimisation system comprised of process and devicensimulators and an RSM optimiser is described. The use of this new TCADnsystem has contributed largely to realising devices with characteristicsnfar superior to the previous DMOS generation of IGBTs. Full experimentalnresults on 1.4 kV trench IGBTs are reported, which are in excellentnagreement with the TCAD predictions
机译:沟槽绝缘栅双极晶体管(IGBT)在从电机控制(1.4 kV)到HVDC(6.5nkV)的广泛应用中被广泛认为是DMOS IGBT和GTO晶闸管的值得替代产品。描述了使用新的全集成优化系统(包括过程和设备仿真器以及RSM优化器)对1.4 kV NPT沟槽IGBT进行的优化设计。这种新的TCADnsystem的使用为实现具有远远优于上一代DMOS IGBT的特性的器件做出了巨大贡献。报告了1.4 kV沟槽式IGBT的全部实验结果,与TCAD的预测非常吻合

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