Effect of angular velocity of spin dryer on wafer drying process

摘要

Effect of angular velocity on spin drying is investigated. Mass and position of water droplet are also discussed. They are also affecting the drying results. Some equations are derived to determine drying result. It is determined by angular velocity, droplet mass, and droplet position. The results show that more angular velocity would be more easily removing the water droplet. And the larger water droplet would be more easily remove. Comparing the spin radius of spin dryer, the difference of water droplet position on wafer is small. Therefore, the position of droplet on wafer has no significant effect on drying and could be ignored. The relationship between angular velocity and size of water droplet is also discussed. An equation is derived. From the results, it is easier to determine result of the drying process. And, by tuning some parameters like angular velocity, it would have better drying results during the spin drying process.