WAFER DRY APPARATUS OF SPIN DRYER AND DRIVING METHOD THEREOF TO PREVENT BREAKING PHENOMENON OF WAFER

摘要

PURPOSE: A wafer dry apparatus for a spin dryer and a driving method thereof are provided to prevent a breaking phenomenon of a wafer by removing a rinsing solution from the wafer in a low-speed rotating state of a spin motor. CONSTITUTION: A controller(30) removes residual liquid from a surface of a wafer by injecting a cleaning gas onto the wafer. A vacuum chuck(34) is used for absorbing and supporting the wafer and rotating the wafer. A plurality of injection nozzles(38a,38b) are used for injecting deionized water onto the wafer according to a control command of the controller. A rotary unit(32) changes rotatory power of the vacuum chuck according to the control command of the controller. A gas supply source(50) is used for supply a cleaning gas. A gas pressure gauge(52) is used for measuring, controlling, and displaying the pressure of the cleaning gas. An air valve(54) is used for supplying or interrupting the cleaning gas. A gas injection nozzle is installed at one end of a gas supply tube in order to remove a rinsing solution from the wafer.