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Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing

机译：将SIMS结构整合到产品晶圆中以执行SIMS和其他材料分析并获得有关前端处理的晶圆级信息

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《》|2006年|P.17-20|共4页
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Budri; T.; Krott; L.; Patel; N.; Smith; A.; Gurcan; B.; Crocker; K.; Supczak; R.; Printy; C.;
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4. Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing [C] . Budri T., Krott L., Patel N., IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop . 2006

机译：在产品晶片中结合SIMS结构，以执行SIMS和其他材料分析并实现有关前端处理的晶圆级信息
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Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing

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