Comparison of lifetime predictions with 3D finite element model of power electronics devices

摘要

Reliability tests and simulated results on medium power components are discussed in this paper. This study is based on statistical data coming from thermal cycling tests (TCT, air-air test) and thermal shock tests (TST, liquid-liquid test), which are correlated with information coming from failure analysis and compared to results issued from 3D finite element (FE) analysis.