High performance atmospheric plasma abatement system for PFC reduction

摘要

Newly developed atmospheric plasma abatement system is suitable to an abatement for single tool of oxide etcher and plasma enhanced CVD for chamber cleaning. Optimized performance of microwave plasma cavity enables to treat up to 80 L/min of CF/sub 4/ exhaust with 95% of DRE at the maximum power of 5.9 kW. This system is applicable to the flow rate range of 40 L/min to 80 L/min. We believe that our proposed plasma abatement system meets semiconductor industry requirements of minimizing COO for PFC reduction.