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Superhydrophobic Silica Thin Films Prepare by Sol-Gel Process for Antistiction of MEMS Devices

机译:溶胶-凝胶法制备超疏水二氧化硅薄膜以抑制MEMS器件

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Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12掳C at ambient conditions) to reduce solvent loss during the high speed spincoating process. After a fluoroalkyl silane treatment, superhydrophobicity is achieved on the as-prepared silica thin film. The solvent can be extracted after the gelation and aging processes. Spin speed effect, eutectic liquid:TEOS ratio in the solution were studied in order to optimize the surface roughness to ensure excellent super-hydrophobicity[1]. Comparison of the silica thin films with silicon pillar surfaces showed that superhydrophobicity for the traditional sol-gel derived silica films demonstrated significant improvement, especially under humid conditions. The AFM force curve obtained with a tipless probe showed that the interaction force is greatly reduced on a rough silica superhydrophobic surface. This result offers great potential to reduce stiction failures in MEMS devices.
机译:基于低表面能涂层的超疏水性理论,我们描述了一种用于MEMS器件的超疏水性防粘二氧化硅涂层。该方法使用了以共晶液体作为模板剂的新型溶胶-凝胶工艺流程。低共熔液体的蒸气压和极低的熔点(在环境条件下为12掳C)可忽略不计,以减少高速旋涂过程中的溶剂损失。在氟代烷基硅烷处理之后,在所制备的二氧化硅薄膜上实现超疏水性。可以在胶凝和老化过程之后提取溶剂。为了优化表面粗糙度,以确保优异的超疏水性,研究了自旋速度效应,溶液中共晶液体与TEOS的比例[1]。二氧化硅薄膜与硅柱表面的比较表明,传统的溶胶-凝胶衍生的二氧化硅薄膜具有超疏水性,特别是在潮湿条件下,表现出显着的改善。用无针探针获得的AFM力曲线表明,在粗糙的二氧化硅超疏水表面上,相互作用力大大降低了。该结果为减少MEMS器件中的粘连故障提供了巨大的潜力。

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