Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

摘要

Silver-copper alloy nanoparticles were synthesized via the polyol process in preparation for the conductive fillers in electrically conductive adhesives. UV absorption and TEM observations showed that the synthesized silver-copper nanoparticles had a randomly mixed alloy structure rather than a core-shell structure, although bulk silver and copper cannot form a solid solution at room temperature.