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A novel asymmetric graded low doped drain (AGLDD) vertical channel nMOSFET with sidewall masked (SWAM) LOCOS isolation

机译:新型非对称渐变低掺杂漏极(AGLDD)垂直沟道nMOSFET,具有侧壁掩膜(SWAM)LOCOS隔离

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摘要

Vertical channel nMOSFET with asymmetric graded low doped drain (AGLDD) structure and sidewall masked (SWAM) LOCOS isolation process is first investigated and experimentally demonstrated. The AGLDD structure, which is formed by conventional ion implantation and impurity diffusion, is adopted to suppress short channel effects and hot carrier effect. The SWAM LOCOS isolation is used to eliminate the parasitic polysilicon sidewall gate capacitances around the active region edge. The fabrication process of this device is compatible with planar CMOS technology. The transistors show veiy good immunity of short channel effects in DC characteristics.
机译:垂直沟道nMOSFET具有非对称分级低掺杂漏极(AGLDD)结构和侧壁掩膜(SWAM)LOCOS隔离工艺,是首次研究和实验证明。采用通过常规离子注入和杂质扩散形成的AGLDD结构来抑制短沟道效应和热载流子效应。 SWAM LOCOS隔离用于消除有源区边缘周围的寄生多晶硅侧壁栅极电容。该器件的制造工艺与平面CMOS技术兼容。晶体管在直流特性方面表现出很好的抗短沟道效应的能力。

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