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首页> 外文期刊>IEEE Electron Device Letters >Reduction of hot-carrier generation in 0.1-/spl mu/m recessed channel nMOSFET with laterally graded channel doping profile
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Reduction of hot-carrier generation in 0.1-/spl mu/m recessed channel nMOSFET with laterally graded channel doping profile

机译:减少侧向渐变沟道掺杂分布的0.1- / splμ/ m嵌入式沟道nMOSFET中热载流子的产生

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摘要

To investigate the substrate current characteristics of a recessed channel structure with graded channel doping profile, we have fabricated and simulated the Inverted-Sidewall Recessed-Channel (ISRC) nMOSFET and compared it with a conventional planar nMOSFET. Experimentally, the ISRC nMOSFET shows about 30% reduction of substrate current, even though the drain current is almost the same. At 0.12-/spl mu/m channel length, the I/sub SUB//I/sub DS/ value of the conventional nMOSFET is measured to be 1.68 times higher than that of the ISRC nMOSFET. Also, using simulation, it is verified that the reduction of electric field at the drain junction of ISRC nMOSFET results from the graded channel doping profile, not from the recessed channel structure.
机译:为了研究具有渐变沟道掺杂轮廓的凹陷沟道结构的衬底电流特性,我们制造并模拟了倒侧壁凹陷沟道(ISRC)nMOSFET,并将其与传统的平面nMOSFET进行了比较。实验上,即使漏极电流几乎相同,ISRC nMOSFET仍可将衬底电流降低约30%。在0.12- / spl mu / m的沟道长度下,传统nMOSFET的I / sub SUB // I / sub DS /值被测量为比ISRC nMOSFET高1.68倍。此外,通过仿真,可以证明ISRC nMOSFET漏极结处的电场减小是由渐变的沟道掺杂分布引起的,而不是由凹陷的沟道结构引起的。

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