A power amplifier module with fully embedded passive components in a LTCC substrate for K-PCS band mobile phone

摘要

Use of accurate circuit models for embedded RF passive components in LTCC (low temperature co-fired ceramics) provides a way to efficiently design high performance RF modules. In this study, in order to increase the accuracy of circuit models, the library of components was developed and the parasitic components were extracted. With the circuit model, the PAM (power amplifier module) was developed using the LTCC process. The module was fabricated with fully embedded passive components within a compact 6/spl times/6/spl times/1.2 mm size, and it exhibited power performance sufficient for K-PCS band mobile phones.