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Design and analysis of the on-chip ESD protection circuit with a constant input capacitance for high-precision analog applications

机译:具有恒定输入电容的片上ESD保护电路的设计和分析,适用于高精度模拟应用

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An on-chip ESD protection design is proposed to solve the ESD protection challenge to the analog pins for high-precision applications. A design model to find the optimized device dimensions and layout spacings on the input ESD clamp devices has been developed to keep the total input capacitance almost constant (within 1% variation), even if the analog signal has an input dynamic range of 1 V. The device dimension (W/L) of the ESD clamp device connected to the I/O pad in the analog ESD protection circuit can be reduced to only 50/0.5 (/spl mu/m//spl mu/m) in a 0.35 /spl mu/m silicided CMOS process, but it can sustain the HBM (MM) ESD level of up to 6 kV (400 V). With such a smaller device dimension, the input capacitance of this analog ESD protection circuit can be significantly reduced to only /spl sim/1.0 pF (including the bond pad capacitance) for high-frequency applications.
机译:提出了一种片上ESD保护设计,以解决高精度应用的模拟引脚的ESD保护挑战。已经开发了一种设计模型,用于找到输入的ESD钳位装置上的优化设备尺寸和布局间距,以保持总输入电容几乎恒定(在1%变化范围内),即使模拟信号的输入动态范围为1 V。连接到模拟ESD保护电路中的I / O焊盘的ESD钳位装置的器件尺寸(W / L)可以在0.35中减少到仅50 / 0.5(/ SPL MU / M / M SCL MU / M) / SPL MU / M硅化CMOS工艺,但它可以维持高达6 kV(400 V)的HBM(mm)ESD水平。利用这种较小的装置尺寸,该模拟ESD保护电路的输入电容可以显着减少到仅用于高频应用的/ SPL SIM / 1.0PF(包括键合焊盘电容)。

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