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Simulation of hot-carrier reliability in MOS integrated circuits

机译:MOS集成电路中热载流子可靠性的仿真

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A software package interfacing to SPICE is developed based on several new or revised models for hot electron studies. For substrate current generation, we present a new model for the characterizing the width of impact ionization region which is channel length and bias dependent. For modeling the hot electron injection into the gate oxide, a revised thermionic emission model is developed. For hot electron induced degradation, previously developed generation-trapping models are used. Good correlations with the experimental and simulation results are obtained. The program can be used to analyze the reliability and the biasing stability of MOS circuits.
机译:基于几种新的或修订的热电子研究模型,开发了与SPICE接口的软件包。对于衬底电流的产生,我们提出了一种新的模型,用于表征碰撞电离区域的宽度,该宽度取决于沟道长度和偏压。为了模拟将热电子注入到栅极氧化物中,开发了修订的热电子发射模型。对于热电子诱导的降解,使用以前开发的世代捕获模型。与实验和仿真结果具有良好的相关性。该程序可用于分析MOS电路的可靠性和偏置稳定性。

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