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Boron-enhanced-diffusion of boron: The limiting factor for ultra-shallow junctions

机译:硼的硼增强扩散:超浅结的限制因素

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Reducing implant energy is an effective way to eliminate transient enhanced diffusion (TED) due to excess interstitials from the implant. It is shown that TED from a fixed Si dose implanted at energies from 0.5 to 20 keV into boron doping-superlattices decreases linearly with decreasing Si ion range, virtually disappearing at sub-keV energies. However, for sub-keV B implants diffusion remains enhanced and x/sub j/ is limited to /spl ges/100 nm at 1050/spl deg/C. We term this enhancement, which arises in the presence of B atomic concentrations at the surface of /spl ap/6%, Boron-Enhanced-Diffusion (BED).
机译:降低植入物能量是消除由于植入物过多的间隙而引起的瞬态增强扩散(TED)的有效方法。结果表明,从固定剂量的Si中以0.5到20 keV的能量注入到硼掺杂超晶格中的TED随着Si离子范围的减小而线性减小,而在低于keV的能量中消失。但是,对于低于keV B的植入物,扩散仍得到增强,并且在1050 / spl deg / C下,x / sub j /限制为/ spl ges / 100 nm。我们称这种增强为硼增强扩散(BED)在/ spl ap / 6%表面存在B原子浓度时产生的增强。

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