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Power-delay metrics revisited for 90 nm CMOS technology

机译:再谈90 nm CMOS技术的功率延迟指标

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Recently, designers have been using the energy-delay product as a metric of goodness for CMOS designs due to certain perceived shortcomings of the more traditional power-delay product. As the industry moves to 90 nm technology, with higher leakage currents, it is an appropriate time to revisit existing design metrics. We provide a more general view of power and delay metrics for design optimization and then illustrate how these metrics can be used. To do so, a re-evaluation of the metrics, based on past and future trends, is carried out and a set of new metrics is proposed. Interestingly, the dominance of leakage power at 90 nm technology and beyond tends to reduce the feasible operating region. We also establish a fundamental relationship between the optimal operating points and the generalized design metrics. Moreover, our initial findings indicate that some designs may need to leak more than expected to achieve certain design targets, running somewhat counter to conventional wisdom.
机译:最近,由于更传统的动力延迟产品的某些感知缺点,设计人员一直使用能量延迟产品作为CMOS设计的良好度的指标。随着行业移动到90纳米技术,具有较高的漏电流,它是重新审视现有设计度量的适当时间。我们提供了更全面的电源和延迟度量的视图,用于设计优化,然后说明如何使用这些度量。为此,基于过去和未来趋势,对指标进行重新评估,并提出了一系列新的指标。有趣的是,90纳米技术和超越泄漏功率的主导地位往往会降低可行的操作区域。我们还建立了最优运营点与广义设计指标之间的基本关系。此外,我们的初步调查结果表明,一些设计可能需要泄漏超过预期,以实现某些设计目标,以与传统智慧有所反击。

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