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MA BE-SONOS: A Bandgap Engineered SONOS using Metal Gate and Al2O3 Blocking Layer to Overcome Erase Saturation

机译:MA BE-SONOS:带隙工程SONOS,使用金属栅极和Al2O3阻挡层来克服擦除饱和

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A bandgap engineered SONOS (BE-SONOS) [1] using Al2O3 top blocking layer and metal gate (MA BE-SONOS) is proposed to provide very fast erase speed without erase saturation. Compared with MANOS [2] using a thick (4.5 nm) tunnel oxide, MA BE-SONOS shows dramatically faster erase speed, owing to the help of bandgap engineered ONO barrier that facilitates hole tunneling. Compared with BE-SONOS using P+-poly gate and top oxide, MA BE-SONOS does not show any erase saturation, owing to the help of metal gate and Al2O3 blocking layer, which greatly reduce gate injection during erase. Very large memory window (>7V) can be achieved with excellent data retention. MA BE-SONOS overcomes the erase difficulty in SONOS-type devices, and is highly potential in the future flash memory technology.
机译:提出了一种使用Al2O3顶部阻挡层和金属栅极(MA BE-SONOS)的带隙工程SONOS(BE-SONOS)[1],以提供非常快的擦除速度,而没有擦除饱和。与使用厚(4.5 nm)隧道氧化物的MANOS [2]相比,MA BE-SONOS显示出显着更快的擦除速度,这归功于带隙设计的ONO势垒,它有助于空穴隧穿。与使用P +多晶硅栅极和顶部氧化物的BE-SONOS相比,由于金属栅极和Al2O3阻挡层的帮助,MA BE-SONOS没有显示任何擦除饱和,从而大大减少了擦除期间的栅极注入。出色的数据保留能力可以实现非常大的存储窗口(> 7V)。 MA BE-SONOS克服了SONOS型设备的擦除困难,并且在未来的闪存技术中具有很大的潜力。

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