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Co-integrated dual strained channels on fully depleted sSDOI CMOSFETs with HfO/sub 2//TiN gate stack down to 15nm gate length

机译:完全耗尽的sSDOI CMOSFET上的共集成双应变通道,具有HfO / sub 2 // TiN栅极堆叠,栅极长度低至15nm

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摘要

We report an original dual channel fully depleted CMOSFET architecture on insulator (DCOI) co-integrating strained-Si (nMOS) and strained-Si/sub 0.6/Ge/sub 0.4/ (pMOS) with HfO/sub 2//TiN gate stacks down to 15nm gate length. We demonstrate for the first time an I/sub ON/ improvement for short channel SOI of 10% at 35nm gate length (25% at 75nm, 100% on long channels) for both n- and p-MOSFETs and a more than 3 decades gate leakage reduction compared to a SiO/sub 2/ dielectric. Meanwhile, thanks to the dual channel engineering, a threshold voltage adjustment is performed with a mid gap single metal gate suitable for high performance (HP) CMOS.
机译:我们报告了在绝缘体(DCOI)上与应变硅(nMOS)和应变硅/ sub 0.6 / Ge / sub 0.4 /(pMOS)与HfO / sub 2 // TiN栅叠层共集成的原始双通道全耗尽CMOSFET架构栅极长度低至15nm。我们首次展示了用于n型和p型MOSFET的短沟道SOI在35nm栅极长度时10%的I / sub ON /改善(在75nm处为25%,在长沟道上为100%)以及超过3年的改进与SiO / sub 2 /电介质相比,减少了栅极泄漏。同时,由于采用了双通道技术,可使用适用于高性能(HP)CMOS的中间隙单金属栅极来执行阈值电压调整。

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