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Antifuse EPROM circuit for field programmable DRAM

机译:用于现场可编程DRAM的反熔丝EPROM电路

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A 3 V EPROM circuit is implemented in an existing 0.22 /spl mu/m DRAM process with an antifuse based on destructive breakdown of the highly-reliable 6.5 nm oxide-nitride-oxide (ONO) storage capacitor dielectric. Using an internal high-voltage charge pump, this antifuse EPROM is programmed without external high-voltage power supplies which facilitates full pin compatibility with existing SDRAM specifications. This antifuse EPROM circuit enables field programmable DRAM functionality such as post-package memory repair, output impedance matching for system memory module calibration, user programmable memory bank architectures, data encryption, and product serial numbers. While laser programmable polysilicon fuses are used extensively to provide nonvolatile memory for repair of defective DRAM cells, they are limited to programming at wafer level and before packaging. Previous implementations of antifuse EPROM utilized external high-voltage supplies for wafer level programming only due to the incompatibility of high voltage power supplies with existing DRAM pin configurations.
机译:在现有的0.22 / spl mu / m DRAM工艺中,基于高度可靠的6.5 nm氧化物-氮化物-氧化物(ONO)存储电容器电介质的破坏性击穿,采用反熔丝实现了3 V EPROM电路。使用内部高压电荷泵,该反熔丝EPROM无需外部高压电源即可进行编程,从而有助于与现有SDRAM规格实现完全的引脚兼容性。该反熔丝EPROM电路实现了现场可编程DRAM功能,例如封装后存储器维修,用于系统存储器模块校准的输出阻抗匹配,用户可编程存储器组架构,数据加密和产品序列号。虽然激光可编程多晶硅熔丝被广泛用于提供非易失性存储器以修复有缺陷的DRAM单元,但它们仅限于在晶圆级和封装之前进行编程。反熔丝EPROM的以前的实现方式仅由于高压电源与现有DRAM引脚配置不兼容而将外部高压电源用于晶片级编程。

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