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CMOS reconfigurable circuits: Integrated mask programmable and field programmable RF circuits.

机译:CMOS可重配置电路:集成的掩模可编程和现场可编程RF电路。

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摘要

The trend of today's RF and microwave market is towards low cost, multi-functional and high performance systems. This research presents solutions to reduce the cost and turn-around time of RF integrated circuits by focusing on novel design approaches for implementing programmable circuits. Two main approaches are discussed; mask programmable RF arrays and field programmable RF arrays.;In the mask programmable technology a complementary metal oxide semiconductor (CMOS) transistor array is used as the basic building block for various RF and microwave circuit implementations. A simple post-CMOS processing technology that utilizes room temperature deposited Parylene-N with low permittivity (K=2.4) and extremely low loss (Loss Tangent < 6x10-4) is introduced. Parylene-N serves as a dielectric material to achieve high performance programmable interconnects, inductors and coplanar waveguide (CPW) transmission lines on the CMOS substrate. The interconnect programmability feature enables implementing various types of passive devices on Parylene-N. Application specific narrowband and wideband RF and microwave circuits are achieved only by changing the top metallization and vias (mask programming). 90nm and 0.13mum RF transistor arrays in standard CMOS technology are used to design state of the art RF amplifiers in the frequency range of 4-22GHz.;To implement field programmable RF and microwave circuits that can be dynamically programmed through software, several approaches are proposed. Integrated programmable tuners using CMOS varactors as well as transistor/capacitor pairs are implemented in standard 0.13mum CMOS technology. By digitally controlling the state of varactors or transistor switches, impedance of a low-loss shielded CPW transmission line is varied to 222 or 220 different impedances. A 4-5.3GHz programmable RF receiver implemented in this thesis is an example of the application of such MEMS-less tuners in RF front-ends of software defined radios. Finally, a fully integrated field programmable dual-state circuit is implemented for the first time in 130nm CMOS technology. A 3-stage distributed topology using shielded CPW lines and transistor switches is designed to operate as either distributed amplifier or distributed mixer and is programmed using one input bit.
机译:当今的射频和微波市场的趋势是朝着低成本,多功能和高性能系统发展。这项研究提出了通过专注于实现可编程电路的新颖设计方法来降低RF集成电路的成本和周转时间的解决方案。讨论了两种主要方法;掩模可编程RF阵列和现场可编程RF阵列。在掩模可编程技术中,互补金属氧化物半导体(CMOS)晶体管阵列被用作各种RF和微波电路实现的基本构件。介绍了一种简单的后CMOS处理技术,该技术利用具有低介电常数(K = 2.4)和极低损耗(损耗角正切<6x10-4)的室温沉积Parylene-N。聚对二甲苯-N用作介电材料,以在CMOS基板上实现高性能的可编程互连,电感器和共面波导(CPW)传输线。互连可编程性功能可在Parylene-N上实现各种类型的无源设备。专用的窄带和宽带RF和微波电路只能通过更改顶部金属化层和过孔(掩模编程)来实现。采用标准CMOS技术的90nm和0.13mum RF晶体管阵列来设计4-22GHz频率范围内的先进RF放大器。为了实现可通过软件动态编程的现场可编程RF和微波电路,有几种方法建议。采用CMOS变容二极管以及晶体管/电容器对的集成可编程调谐器采用标准的0.13um CMOS技术实现。通过数字控制变容二极管或晶体管开关的状态,低损耗屏蔽式CPW传输线的阻抗变为222或220个不同的阻抗。本文中实现的4-5.3GHz可编程RF接收器是此类无MEMS调谐器在软件无线电的RF前端中的应用示例。最终,在130nm CMOS技术中首次实现了完全集成的现场可编程双态电路。使用屏蔽CPW线和晶体管开关的3级分布式拓扑被设计为可作为分布式放大器或分布式混频器使用,并使用一个输入位进行编程。

著录项

  • 作者

    Rabieirad, Laleh.;

  • 作者单位

    Purdue University.;

  • 授予单位 Purdue University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 132 p.
  • 总页数 132
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:39:30

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