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Thermionic vacuum integrated microcircuits as mechanical transducers

机译:热离子真空集成微电路作为机械传感器

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Dielectric layers of anodic alumina (AA) are widely used as substrates and insulating elements in various design configurations of electron devices. Combination of anodizing with photolithographic and etching processes as well as vacuum deposition of conductive, resistive, semiconductor and dielectric films makes it possible to create, in a three-dimensional dielectric structure, holes, cavities, etc., with thin-film microcircuit components formed to a high degree of accuracy on different levels (with respect to the main working surface of the substrate). Three-dimensional multilevel microreliefed substrates form a structural basis of unique thermo- and radiation-resistant thermionic VIMCs. The possibility has been demonstrated of making simple logic and analog electrical circuits in the form of VIMC. Particular promising is the use of porous anodic alumina substrates for fabrication of multi-point field emitters where the size of each cell lies within several thousand angstrom.
机译:阳极氧化铝(AA)的介电层被广泛用作电子设备的各种设计配置中的衬底和绝缘元件。将阳极氧化与光刻和蚀刻工艺相结合,以及真空沉积导电,电阻,半导体和介电膜的方法,可以在三维介电结构中形成形成薄膜微电路组件的孔,腔等。在不同水平上(相对于基板的主工作表面)具有很高的精度。三维多级微浮雕基板构成了独特的耐热和耐辐射热离子VIMC的结构基础。已经证明了以VIMC形式制造简单的逻辑和模拟电路的可能性。特别有希望的是使用多孔阳极氧化铝基板制造多点场致发射器,其中每个单元的大小在几千埃之内。

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