Recent advances in thermal/flow simulation: integrating thermal analysis into the mechanical design process

摘要

There has been increasing interest in and emphasis on the use of computer based analytical tools for simulation of thermal phenomena in electronic systems. Concurrent engineering of such systems demands the complete integration of analysis tools into parametric mechanical design software. Intelligent and associative integration between design and analysis activities can effect more rapid turnaround. Analysis can drive the design process and down-stream activities which alter the design will automatically update analysis models. A next generation system has been developed, based on proven simulation technology, that improves efficiency over currently available solutions. The package combines the intuitive characteristics of thermal network modeling with powerful computational fluid dynamics technology to model 3D fluid flow. Experimental thermal measurements for several cases are compared to values calculated by the system. Good correlation with experimental results is demonstrated for each of the test cases. In addition, the need for flexible modeling tools is demonstrated. Tools to facilitate an understanding of heat transfer and fluid flow are an essential part of the thermal engineering process.