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Dielctric Surface Breakdown Of High Purity silicon

机译:高纯硅的介电表面击穿

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We report the results of measurements conducted on the electrical breakdown of high resistivity (- 20 K/spl Omega/-cm) single crystal silicon. The salient features of the measurements are briefly described below. The voltage-current data shows space charge limited conduction for applied voltage below pre-breakdown. The measurement of the decrease in the time delay between the applied voltage and the breakdown current exhibited a linear dependence on the applied voltage. The pulse forming network used in our measurements had an internal impedance (- 260 /spl Omega/) which limited the peak power applied to the sample and it permitted repeated breakdown shots without "damaging" the silicon surface. This feature allowed us to study of the effect of voltage conditioning of the sample with applied voltage exceeding breakdown threshold of the unsullied sample. A higher holdoff voltage was obtained after conditioning the sample with 100 shots where the applied voltage was at or near the breakdown condition. Conditioning was reversed through exposure to laboratory air but not to dry nitrogen. Water vapor and/or oxygen seem to play a significant role in the sample's conditioning and its reversal. The major species desorbed during breakdown were identified using a mass spectroscopic technique. It seems that the desorbed species are released by hermally initiated surface (not bulk) processes due to localized high current density filaments on or near the surface. During a typical surface breakdown shot approximately 10/sup 12/ electrons are injected into the sample whereas, the pressure rise obtained under high vacuum condition (base pressure=3x10/sup -8/ torr) indicates that approximately 10/sup 14/ atoms or molecules are desorbed. The resulting pressure change due to the surface breakdown is approximately linearly proportional to the peak power while the deposited energy vs. pressure change does not follow the same behavior. Also, the thermal description mass spectrogram agrees with the desorption mass spectrogram obtained form our silicon surface flashover. these results suggest that for silicon the gas description udring breakdown in a thermal process and is not due to electron impact description or other cascade processes. Our work supports the thermal description hypothesis of other researchers.
机译:我们报告了对高电阻率(-20 K / splΩ/ -cm)单晶硅的电击穿进行的测量结果。测量的主要特征在下面简要描述。电压-电流数据显示了对于低于预击穿电压的施加电压,空间电荷受限的导通。所施加的电压和击穿电流之间的时间延迟的减小的测量显示出对所施加的电压的线性依赖性。我们的测量中使用的脉冲形成网络具有内部阻抗(-260 / spl Omega /),该阻抗限制了施加到样品的峰值功率,并且允许重复击穿而不会“损坏”硅表面。此功能使我们能够研究施加电压超过未污染样品的击穿阈值时样品的电压调节效果。在施加的电压处于击穿条件或接近击穿条件的条件下,对样品进行100次激发后,可获得较高的释抑电压。通过暴露于实验室空气而不是干燥的氮气来逆转条件。水蒸气和/或氧气似乎在样品的调理及其逆转中起重要作用。使用质谱技术鉴定了在分解过程中解吸的主要物质。似乎由于在表面上或附近的局部高电流密度细丝,通过解吸引发的表面(而非本体)过程释放了解吸的物质。在典型的表面击穿过程中,将大约10 / sup 12 /个电子注入到样品中,而在高真空条件下(基本压力= 3x10 / sup -8 / torr)获得的压力升高表明大约10 / sup 14 /个原子或分子被解吸。由于表面击穿而导致的最终压力变化与峰值功率大致成线性比例,而沉积的能量与压力的变化则不遵循相同的行为。同样,热描述质谱图与从我们的硅表面闪络获得的解吸质谱图一致。这些结果表明,对于硅,气体描述会在热处理过程中破裂,而不是由于电子撞击描述或其他级联过程。我们的工作支持其他研究人员的热描述假设。

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