Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method

摘要

Full-size models of a detector unit for a silicon microvertex detector for the KEK B factory have been built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end-boards mounted with dummy readout VLSIs on both sides. In this trial the flip-chip bonding method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 mu m.