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Improved step coverage of silane-based PECVD nitride and oxynitride passivation films

机译:改善了基于硅烷的PECVD氮化物和氮氧化物钝化膜的台阶覆盖率

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摘要

The effects of gas flow and electrode spacing on the step coverage of silane-based nitride and oxynitride films formed by plasma-enhanced chemical-vapor deposition have been studied. It was found that the sidewall step coverage and sidewall film wet etch rate can be improved by varying these process parameters.
机译:研究了气体流量和电极间距对通过等离子体增强化学气相沉积形成的硅烷基氮化物和氮氧化物薄膜台阶覆盖率的影响。已经发现,通过改变这些工艺参数可以提高侧壁台阶覆盖率和侧壁膜湿蚀刻速率。

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