The application of standard hybrid packaging techniques to the implementation of power conditioning circuits leaves much to be desired with respect to performance. Then use of high efficiency metallization techniques, such as direct bond copper (DBQ, in conjunction with state-of-the-art ceramic packages, offers the power designer significant performance advantages. Locating the drive circuitry in close proximity to the high current switches, without sacrificing efficiency, is a key layout requirement which requires considerable expertise. Rectification schemes are evaluated for optimum efficiency. Low resistance MOSFET's show clear advantages with synchronous rectification in comparison to silicon Schottky rectifiers for DC/DC converters operating at less than 6V DC output and with efficiencies greater than 88%.
展开▼
