The evaluation of air-flow systems for telecommunication equipment rooms was carried out experimentally. Parameters were room air temperature distribution and ambient temperature of electric parts, i.e. air temperature around circuit boards, which are influenced by an air-flow system. The under-floor air supply and overhead return system has shown to be superior to other flow systems and its allowable average heat density was up to 1.1 kW/m/sup 2/. A microcomputer control unit was developed for the cooling unit. It is shown that this control can optimize the refrigeration cycle of the cooling unit under low outdoor air temperature, minimizing running costs.
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机译:对电信机房气流系统的评估是通过实验进行的。参数是室内空气温度分布和电气部件的环境温度,即电路板周围的空气温度,这些温度受气流系统的影响。地板下供气和高架回风系统已显示出优于其他气流系统,其允许的平均热密度高达1.1 kW / m / sup 2 /。开发了用于冷却单元的微计算机控制单元。结果表明,这种控制可以在室外空气温度较低的情况下优化冷却装置的制冷循环,从而最大程度地降低运行成本。
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