Repair machine for integrated circuits using laser-induced microchemistry

摘要

Summary form only given. Design mistakes may appear during the validation steps of integrated circuits. Designers need a machine able to modify the interconnection network in an IC prototype during tests. A repair process by laser direct writing of microstructure was achieved via local decomposition of gases in submicron areas on IC chips. Experimental procedures for conductor (Ni) or insulator (Si/sub 3/N/sub 4/) deposition and microelectronic material (SiO/sub 2/-Al) etching were defined. This work led to a VLSI repair machine gathering all these elementary reactions in one process, allowing designers to modify quickly and efficiently interconnection networks.