Centre of Advanced Materials for Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre of Advanced Materials for Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre of Advanced Materials for Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
Centre of Advanced Materials for Joining, Department of Mechanical and Mechatronics Engineering, University of Waterloo, 200 University Avenue West, Waterloo, ON, N2L 3G1, Canada;
nanosintering; silver; densification; surface premelting;
机译:低温烧结行为(AE&货币& 400a c)通过银纳米粒子通过表面碘化的微尺寸银颗粒
机译:纳米银浆无压烧结以粘结大面积电子封装用大功率(每千日元零件100 mm(2))功率芯片的参数研究
机译:基于醚型溶剂增强微米银浆的低温和无压烧结
机译:低温下银纳米粒子的无压烧结行为
机译:使用纳米粒子烧结助剂和本体成型技术对粉末加工的渐变金属陶瓷复合材料进行无压烧结。
机译:玻璃纳米粒子低温矿化烧结过程的结晶行为
机译:机械合金化和低温无压烧结制备的P型Bi85Sb15-xSnx合金的热电性能