Understanding advanced lithographic materials: challenges and new characterization techniques

摘要

Abstract: The implementation of new resist materials and advanced lithography processes requires new characterization techniques in order to understand the behavior of these systems and optimize their design. Examples are presented on two recent 193nm experimental formulations using three different characterization techniques, namely Modulated- Temperature DSC, in-situ ellipsometry and dielectric analysis. The results obtained provide new experimental evidence of the diffusion and reaction mechanisms involved in chemically amplified formulations. !11