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Pure-silica zeolite low-k dielectric thin films by spin-on process

机译:旋涂法制备纯硅沸石低k介电薄膜

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Spin-on silicalite thin films were prepared from silicalite nanocrystals. Spin-on silicalitefilms with high porosity have a dielectric constant (k) of 1.8-2.2. A secondary growth ofnanocrystals was carried out on spin-on films under microwave treatment. It was found that asecondary growth of nanocrystals by microwave treatment could increase the mechanicalstrength and control the inter-particle pore size and porosity of spin-on silicalite films.Microwave-treated spin-on films have a k value of 2.2-2.4. The effect of moisture on k valuewas also studied. The silylation of silicalite films with chlorotrimethylsilane was conductedto eliminate the effect of moisture on the dielectric constant. It was revealed that stable kvalues were obtained after silylation.
机译:从硅沸石纳米晶体制备旋涂硅沸石薄膜。具有高孔隙率的旋涂硅沸石膜的介电常数(k)为1.8-2.2。在微波处理下,在旋涂膜上进行了纳米晶体的二次生长。研究发现,微波处理纳米晶体的二次生长可以提高机械强度,并控制旋涂硅质岩薄膜的粒子间孔径和孔隙率。微波处理的旋涂薄膜的k值为2.2-2.4。还研究了水分对k值的影响。用氯代三甲基硅烷进行硅沸石膜的甲硅烷基化,以消除水分对介电常数的影响。揭示了甲硅烷基化后获得稳定的k值。

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