首页> 外文会议>IPC SMEMA Council APEX Exhibition Conference: Proceedings of the Technical Program Jan 19-24, 2002 San Diego, California >How To Deposit Thirty Million Glue Dots Per Hour (And Then Print Three Dimensional Solder Paste)
【24h】

How To Deposit Thirty Million Glue Dots Per Hour (And Then Print Three Dimensional Solder Paste)

机译:如何每小时沉积三千万个胶点(然后打印三维锡膏)

获取原文
获取原文并翻译 | 示例

摘要

In spite of all predictions, wave soldering is still alive and well. When a high-speed component placer fronts the wave, a high-speed glue deposition machine is also needed. Stencil printing has the potential to be an extremely high-speed process. When coupled with thick stencils, many of the perceived limitations of stencilling are eliminated. These same thick stencils can be adapted to print solder paste in some previously impossible situations.
机译:尽管做出了所有预测,但波峰焊接仍然有效。当高速部件放置器在波浪面前时,还需要高速胶水沉积机。模板印刷有可能成为极高速的过程。当与较厚的模板连接时,消除了模板的许多局限性。这些相同的厚模板可适合在某些以前不可能的情况下印刷焊膏。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号